Requisition # E1871642
Job Title Bluetooth Software Engineering Intern - Summer 2010
Post Date 2/7/2010
Division Qualcomm Innovation Center
Job Area Engineering - Software
Location Illinois - Champaign/Urbana
Job Function **This is for an intern position located in Champaign, Illinois. Please do not apply if you are not interested in this office location.**

Ranked #16 by Fortune Magazine's annual '100 Best Companies to Work For' and headquartered in San Diego, Qualcomm develops, manufactures, markets, licenses, and operates advanced 3G communications systems and products based on its proprietary digital wireless technologies. To ensure that the entire wireless industry is inspired and continues to evolve, innovate and experience success, QUALCOMM develops its technologies and solutions for the purpose of enabling key participants in the wireless value chain.

The Wireless Connectivity team in Champaign, Illinois, is working on leading edge Bluetooth technologies for mobile phone platforms. Their current project is to design and develop new and innovative solutions for advanced Bluetooth features including printing and imagine profiles for both the Windows Mobile and Linux software platforms. Students will be involved in one or more of the following areas: software module development, feature testing, configuration management and lab tools support.
Skills/Experience -Knowledge in real-time microprocessor-based embedded programming
-Embedded real-time operating systems are a plus.
-Classwork in digital communication, data structures in C, basic OS, and digital circuit design are also beneficial.
-Any class projects/thesis/experience in Wireless technologies like Bluetooth and/or software development for Microsoft Windows/Windows Mobile and Linux are a plus.
Responsibilities
Education Requirements Required: In Study, Computer Engineering and/or Computer Science. GPA must be 3.0 or higher. Grad date must be Aug 2010 or later.