Requisition # E1878769
Job Title Intern - RFIC Design Engineer (SD) - Summer 2010
Post Date 3/3/2010
Division Qualcomm CDMA Technology
Job Area Engineering - Hardware
Location California - San Diego
Job Function QUALCOMM CDMA Technologies (QCT) is the largest provider of 3G chipset and software technology in the world, with chipsets shipped to more than 50 customers and powering the majority of all 3G devices commercially available. QCT partners with nearly 60 3G network operators around the globe and has the largest CDMA engineering team in the wireless industry.

QCT provides complete chipset solutions and integrated applications from the Launchpad suite of advanced technologies. Our integrated solutions offer device manufacturers reduced bill-of-materials costs, time-to-market, and development time. Mobile handsets powered by QCT chipsets can offer more features while maintaining a smaller, sleeker form-factor and benefiting from reduced power demands.

QCT values collaboration with its customers and partners and works closely with them to enable their success. We offer a wide range of tools to support the device development process, and develop new technologies based on the needs and demands of the wireless market. Devices for all market segments can now include features enabled by 3G wireless technology, in demand by a growing and increasingly sophisticated wireless community.

The intern would work closely with an experienced designer on challenging RF/analog IC design.
Skills/Experience Project in RF CMOS IC design. Tools: Cadence, spectreRF, Layout.
Responsibilities
Education Requirements Coursework or research towards a PhD, Master's degree in E.E. Classes: RF design & theory, analog design in RF CMOS or bipolar technologies, semi conductor physics and communication theory.